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  scls307b? january 1996 ? revised january 2003 1 post office box 655303 ? dallas, texas 75265  wide operating voltage range of 2 v to 6 v  outputs can drive up to 10 lsttl loads  low power consumption, 80- a max i cc  typical t pd = 12 ns  4-ma output drive at 5 v  low input current of 1 a max  eight flip-flops with single-rail outputs  clock enable latched to avoid false clocking  applications include: ? buffer/storage registers ? shift registers ? pattern generators description/ordering information these devices are positive-edge-triggered octal d-type flip-flops with an enable input. the ?hc377 devices are similar to the ?hc273 devices, but feature a latched clock-enable (clken ) input instead of a common clear. information at the data (d) inputs meeting the setup time requirements is transferred to the q outputs on the positive-going edge of the clock (clk) pulse, if clken is low. clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. when clk is at either the high or low level, the d input has no effect at the output. these devices are designed to prevent false clocking by transitions at clken . ordering information t a package ? orderable part number top-side marking pdip ? n tube sn74hc377n sn74hc377n 40 cto85 c soic dw tube sn74hc377dw hc377 ?40 c to 85 c soic ? dw tape and reel sn74hc377dwr hc377 sop ? ns tape and reel SN74HC377NSR hc377 cdip ? j tube snj54hc377j snj54hc377j ?55 c to 125 c cfp ? w tube snj54hc377w snj54hc377w 55 c to 125 c lccc ? fk tube snj54hc377fk snj54hc377fk ? package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. 3212019 910111213 4 5 6 7 8 18 17 16 15 14 8d 7d 7q 6q 6d 2d 2q 3q 3d 4d 1d 1q clken 5q 5d v 8q 4q gnd clk sn54hc377 . . . fk package (top view) cc sn54hc377 ...j or w p ackage sn74hc377 ...dw, n, or ns p ackage (top view) 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 clken 1q 1d 2d 2q 3q 3d 4d 4q gnd v cc 8q 8d 7d 7q 6q 6d 5d 5q clk copyright ? 2003, texas instruments incorporated please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
scls307b ? january 1996 ? revised january 2003 2 post office box 655303 ? dallas, texas 75265 function table (each flip-flop) inputs output clken clk d output q h x x q 0 l hh l ll x l x q 0 logic diagram (positive logic) clken 1 11 3 2 clk 1d 1q c1 1d c1 1d c1 1d c1 1d c1 1d c1 1d c1 1d c1 1d 5 2q 6 3q 9 4q 12 5q 15 6q 16 7q 19 8q 4 2d 7 3d 8 4d 13 5d 14 6d 17 7d 18 8d
scls307b ? january 1996 ? revised january 2003 3 post office box 655303 ? dallas, texas 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage range, v cc ? 0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input clamp current, i ik (v i < 0 or v i > v cc ) (see note 1) 20 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . output clamp current, i ok (v o < 0 or v o > v cc ) (see note 1) 20 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous output current, i o (v o = 0 to v cc ) 25 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous current through v cc or gnd 50 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, ja (see note 2): dw package 58 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . n package 69 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ns package 60 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ? 65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ? absolute maximum ratings ? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ? recommended operating conditions ? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. the input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. the package thermal impedance is calculated in accordance with jesd 51-7. recommended operating conditions (see note 3) sn54hc377 sn74hc377 unit min nom max min nom max unit v cc supply voltage 2 5 6 2 5 6 v v cc = 2 v 1.5 1.5 v ih high-level input voltage v cc = 4.5 v 3.15 3.15 v v ih high level in ut voltage v cc = 6 v 4.2 4.2 v v cc = 2 v 0.5 0.5 v il low-level input voltage v cc = 4.5 v 1.35 1.35 v v il low level in ut voltage v cc = 6 v 1.8 1.8 v v i input voltage 0 v cc 0 v cc v v o output voltage 0 v cc 0 v cc v v cc = 2 v 1000 1000 ? t/ ? v input transition rise/fall time v cc = 4.5 v 500 500 ns ? t/ ? v in ut transition rise/fall time v cc = 6 v 400 400 ns t a operating free-air temperature ? 55 125 ? 40 85 c note 3: all unused inputs of the device must be held at vcc or gnd to ensure proper device operation. refer to the ti applicatio n report, implications of slow or floating cmos inputs , literature number scba004.
scls307b ? january 1996 ? revised january 2003 4 post office box 655303 ? dallas, texas 75265 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions v t a = 25 c sn54hc377 sn74hc377 unit parameter test conditions v cc min typ max min max min max unit 2 v 1.9 1.998 1.9 1.9 i oh = ? 20 a 4.5 v 4.4 4.499 4.4 4.4 v oh v i = v ih or v il i oh 20 a 6 v 5.9 5.999 5.9 5.9 v v oh v i v ih or v il i oh = ? 4 ma 4.5 v 3.98 4.3 3.7 3.84 v i oh = ? 5.2 ma 6 v 5.48 5.8 5.2 5.34 2 v 0.002 0.1 0.1 0.1 i ol = 20 a 4.5 v 0.001 0.1 0.1 0.1 v ol v i = v ih or v il i ol 20 a 6 v 0.001 0.1 0.1 0.1 v v ol v i v ih or v il i ol = 4 ma 4.5 v 0.17 0.26 0.4 0.33 v i ol = 5.2 ma 6 v 0.15 0.26 0.4 0.33 i i v i = v cc or 0 6 v 0.1 100 1000 1000 na i cc v i = v cc or 0, i o = 0 6 v 8 160 80 a c i 2 v to 6 v 3 10 10 10 pf timing requirements over recommended operating free-air temperature range (unless otherwise noted) v t a = 25 c sn54hc377 sn74hc377 unit v cc min max min max min max unit 2 v 5 3 4 f clock clock frequency 4.5 v 25 16 20 mhz f clock clock frequency 6 v 29 19 23 mhz 2 v 100 150 125 t w pulse duration, clk high or low 4.5 v 20 30 25 ns t w pulse duration, clk high or low 6 v 17 25 21 ns 2 v 100 150 125 d 4.5 v 20 30 25 t set p time before clk 2 v 100 150 125 ns clken high or low 4.5 v 20 30 25 clken high or low 6 v 17 25 21 2 v 5 5 5 t h hold time after clk clken inactive or active, data 4.5 v 5 5 5 ns h , 6 v 5 5 5
scls307b ? january 1996 ? revised january 2003 5 post office box 655303 ? dallas, texas 75265 switching characteristics over recommended operating free-air temperature range, c l = 50 pf (unless otherwise noted) (see figure 1) parameter from to v t a = 25 c sn54hc377 sn74hc377 unit parameter from (input) to (output) v cc min typ max min max min max unit 2 v 5 11 3 4 f max 4.5 v 25 54 16 20 mhz f max 6 v 29 64 19 23 mhz 2 v 56 160 240 200 t pd clk any 4.5 v 15 32 48 40 ns t d clk any 6 v 12 27 41 34 ns 2 v 38 75 110 95 t t any 4.5 v 8 15 22 19 ns t y 6 v 6 13 19 16 operating characteristics, t a = 25 c parameter test conditions typ unit c pd power dissipation capacitance per flip-flop no load 30 pf
scls307b ? january 1996 ? revised january 2003 6 post office box 655303 ? dallas, texas 75265 parameter measurement information voltage waveforms setup and hold and input rise and fall times voltage waveforms pulse durations t h t su 50% 50% 50% 10% 10% 90% 90% v cc v cc 0 v 0 v t r t f reference input data input 50% high-level pulse 50% v cc 0 v 50% 50% v cc 0 v t w low-level pulse voltage waveforms propagation delay and output transition times 50% 50% 50% 10% 10% 90% 90% v cc v oh v ol 0 v t r t f input in-phase output 50% t plh t phl 50% 50% 10% 10% 90% 90% v oh v ol t r t f t phl t plh out-of-phase output notes: a. c l includes probe and test-fixture capacitance. b. phase relationships between waveforms were chosen arbitrarily. all input pulses are supplied by generators having the followi ng characteristics: prr 1 mhz, z o = 50 ? , t r = 6 ns, t f = 6 ns. c. for clock inputs, f max is measured when the input duty cycle is 50%. d. the outputs are measured one at a time with one input transition per measurement. e. t plh and t phl are the same as t pd . test point from output under test c l = 50 pf (see note a) load circuit figure 1. load circuit and voltage waveforms
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-87807012a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962-8780701ra active cdip j 20 1 tbd a42 snpb n / a for pkg type sn54hc377j active cdip j 20 1 tbd a42 snpb n / a for pkg type sn74hc377dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377n active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74hc377ne4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type SN74HC377NSR active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74HC377NSRe4 active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim snj54hc377fk active lccc fk 20 1 tbd post-plate n / a for pkg type snj54hc377j active cdip j 20 1 tbd a42 snpb n / a for pkg type (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 29-jun-2006 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 29-jun-2006 addendum-page 2

mechanical data mlcc006b october 1996 post office box 655303 ? dallas, texas 75265 fk (s-cqcc-n**) leadless ceramic chip carrier 4040140 / d 10/96 28 terminal shown b 0.358 (9,09) max (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) a no. of min max 0.358 0.660 0.761 0.458 0.342 (8,69) min (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32) (18,78) ** 20 28 52 44 68 84 0.020 (0,51) terminals 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 12 13 14 15 16 18 17 11 10 8 9 7 5 4 3 2 0.020 (0,51) 0.010 (0,25) 6 1 28 26 27 19 21 b sq a sq 22 23 24 25 20 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. this package can be hermetically sealed with a metal lid. d. the terminals are gold plated. e. falls within jedec ms-004



important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security low power wireless www.ti.com/lpw telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2006, texas instruments incorporated


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